LDGRB-01 3BSE013177R1 ABB

ABB LDGRB-01 (3BSE013177R1) Product Overview & Technical Specifications
Product Brief
The ABB LDGRB-01 (3BSE013177R1) is a DIN‑rail mountable passive I/O backplane for the AC 800M local I/O system, designed to connect up to 4 standard I/O modules and interface with the AC 800M CPU via dedicated ribbon cable, supporting hot‑swap and reliable signal/power distribution in industrial control environments.
Brand  ABB (ASEA Brown Boveri)
Model  LDGRB-01, part number 3BSE013177R1

LDGRB-01 3BSE013177R1

Dimensions
The backplane measures 22.5 mm (width) × 115 mm (height) × 90 mm (depth), with a weight of approximately 0.2 kg, and is engineered for 35 mm DIN‑rail mounting (EN 60715) in standard control cabinets with IP20 protection.
Key Features
Local I/O Expansion: Serves as a passive backplane for the AC 800M system, accommodating up to 4 LD‑series standard I/O modules to extend local I/O capacity.
DIN‑Rail & Compact Design: 35 mm DIN‑rail compatible with a slim 22.5 mm width, enabling dense cabinet integration and space‑efficient I/O expansion.
Hot‑Swap Support: Enables module replacement without powering down the system, minimizing downtime during maintenance or upgrades (when used with compatible I/O modules).
Gold‑Plated Contacts: Ensures reliable electrical connections for 5 V logic signals and power distribution, enhancing signal integrity and longevity.
Wide Environmental Range: Operates from −25°C to +60°C, with storage from −40°C to +85°C, and tolerates 5%–95% non‑condensing humidity, suitable for harsh industrial settings.
System Compatibility: Connects directly to AC 800M CPU local I/O interfaces (e.g., CI854) via dedicated ribbon cable, with a maximum local I/O distance of 1.5 meters from the CPU.
Certifications & Safety: Compliant with CE, UL/cUL, and IEC 61010‑1, with IP20 ingress protection for cabinet‑mounted use.

LDGRB-01 3BSE013177R1

Input & Output
Input Specifications
Power Input: Receives 24 V DC (19.2–30 V DC range) from the system power supply, distributing regulated power to connected I/O modules with reverse polarity and overvoltage protection.
Communication Input: Dedicated ribbon‑cable interface for data and control signals from the AC 800M CPU, enabling high‑speed, low‑latency I/O data exchange.
Module Inputs: Accepts up to 4 standard LD‑series I/O modules (digital, analog, or specialty types), with gold‑plated connectors for stable signal input from field devices.
Output Specifications
Power Output: Distributes 24 V DC and 5 V logic power to each installed I/O module, ensuring consistent power delivery for reliable field device operation.
Signal Output: Routes processed I/O signals (digital/analog) from modules to the AC 800M CPU via the ribbon‑cable interface, supporting real‑time control and monitoring.
Status Indicators: Integrated LED outputs for power and communication status, providing visual feedback for quick diagnostics of backplane operation.
Module Outputs: Enables each connected I/O module to drive field loads (e.g., 24 V DC digital outputs, analog signals) with galvanic isolation to prevent ground loops and enhance noise immunity.